Hong Leong Asia To Issue S$50M 1Y Bonds At 3.885% -Source
Hong Leong Asia To Issue S$50M 1Y Bonds At 3.885% -Source
Hong Leong Asia To Issue S$50M 1Y Bonds At 3.885% -Source
SINGAPORE (Dow Jones)–Singapores Hong Leong Asia (H22.SG) plans to issue a S$50 million one-year fixed-rated bond at 3.885% next month, a source close to the deal said Monday.
Institutional investors have already taken up the bond issue, which will be issued May 16, the source said. Standard Chartered Singapore is the lead manager for the transaction.
Hong Leong Asia is the manufacturing arm of Hong Leong Group, a conglomerates with about 510 companies, including nine listed companies.
More: sg.biz.yahoo.com
